Call for data, demonstrations and tools

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The Data, Demonstrations, and Tools track provides an opportunity for live demonstrations of academic or commercial product-line tools, of a (substantial) dataset to be shared with the community, and of practices tackling current industrial challenges.

IMPORTANT DATES

Paper submission:        Apr 10, 2018 Apr 24, 2018
Notification:                   May 5, 2018 May 25, 2018
Camera-ready papers:  Jun 7, 2018 Jul 2, 2018

TOPICS

Areas of interest include, but are not limited to:

  • feature modeling,
  • variant management,
  • validation and verification,
  • product derivation and generation,
  • product-line testing and further analyses,
  • measurement and optimization of non-functional properties of product lines,
  • language product lines.

SUBMISSIONS/PUBLISHING

Data papers should describe a dataset, including:

    • its content and origin;
    • the methodology and tools used to obtain it;
    • the schema, structure, or layout to store it;
    • usage scenarios or open analysis challenges for it;
    • relationships to other existing datasets;
    • its current limitations.

The data must be made available to the reviewers upon submission and should eventually be published upon acceptance.

Demonstration papers should illustrate the existing practice, assumptions behind the approach, and actual or potential limitations and challenges. We welcome both demonstrations of early implementations of novel system or software product line engineering concepts as well as demonstrations of mature tools. The use of real­is­tic use cases is strongly encouraged. All demonstration papers should contain an appendix of at most 2 pages with a brief description of how the presentation will be conducted.

Tool papers must present either a new tool, a new tool component, or novel extensions to an existing tool. Tools previously presented at SPLC should include a specific description of the new features of the tool. Tool papers should provide a short description of the theoretical foundations, after which emphasis should be on the design and implementation concerns (incl. software architecture and core data structures), closed by the description of experience with realistic case studies. It is strongly encouraged to make the tool publicly available, preferably on the web, even if only for the evaluation process.

The page limit is 4 pages and may have an appendix of at most 2 pages. Submissions must follow the ACM proceedings format and will be reviewed by the data, demonstrations and tools track committee following high scientific standards.

The ACM styles have changed recently, and all authors should use the official 2017 ACM Master article template. Latex users are indicated to use the “sigconf” option, so they are recommended to use the template that can be found in “sample-sigconf.tex”. In this way, the following latex code can be placed at the start of the latex document:

\documentclass[sigconf]{acmart}

\acmConference[SPLC'18]{22nd International Conference on Software Product Line}{10--14 September, 2018}{Gothenburg, Sweden}

The SPLC proceedings will be published in the ACM Digital Library. SPLC is ranked as a top conference.
At least one author of each accepted submission must register and attend SPLC 2018 in order for the submission to be published.
Submissions should be sent using EasyChair: https://easychair.org/conferences/?conf=splc2018

CHAIRS

 

Jianmei Guo
Alibaba Group, P.R. China
Philippe Collet

Université Côte d'Azur, France

PROGRAM COMMITTEE

  • Maurice ter Beek, ISTI-CNR, Italy
  • Sandy Beidu, University of Waterloo, Canada
  • Oscar Díaz, University of the Basque Country, Spain
  • Guisheng Fan, East China University of Science and Technology, China
  • Wolfram Fenske, Otto-von-Guericke Universität Magdeburg, Germany
  • Jose A. Galindo, University of Seville, Spain
  • Alex Grebhahn, University of Passau, Germany
  • Peng Liang, Wuhan University, China
  • Leticia Montalvillo, University of the Basque Country, Spain
  • Gilles Perrouin, University of Namur, Belgium
  • Atrisha Sarkar, University of Waterloo, Canada
  • Stefan Stanciulescu, ABB Corporate Research, Switzerland
  • Tewfik Ziadi, University Pierre et Marie Curie, France